Typical stress tests for microelectronic systems are most often accelerated standardized methods such as Temperature Cycling. Thermal Shock or Humidity Test etc. Desirable is the detection of failures by non-destructive methods such as high resolution 3-D computer tomography, scanning acoustic microscopy or lock-in thermography.
Time honored destructive methods such as metallographic cross-sectioning are offered for quality assurance or defect detection.
- Metallographic cross-sectioning
- Deformation analysis by DIC
- CSAM, SEM, 3D-CT
- Failure mode investigation (Cracks, Delamination, Fatigue)
- Dimension and geometry verification
We utilize state of the art metallographic sectioning technique to observe failure modes in materials